New semiconductor packaging system

We support the development of next-generation semiconductor manufacturing equipment.

■ By designing and editing the GDSⅡ system, the wiring data of the LSI can be converted into 3D data.

■ It corresponds to laser type NCVIA with thickness information added.

■ With the programming function, you can build a new cooperation format.

  • Minimal Fab

    ※Please Contact us for details.