Three-dimensional collection case
In the "DreamChip Project" that was conducted from 2008 to 2014, 3D integration of large-scale data was realized.
■ Three-dimensional image sensor module
[START] was used for 3D visualization and integrated verification in the research and development of 3D element technology embedded in digital-analog.
■ Super wide bus memory 3D-SiP
Memory chip, Si-IP, logic chip and organic interposer are placed on the same data of [START].
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