Three-dimensional collection case

In the "DreamChip Project" that was conducted from 2008 to 2014, 3D integration of large-scale data was realized.

■ Three-dimensional image sensor module

[START] was used for 3D visualization and integrated verification in the research and development of 3D element technology embedded in digital-analog.

■ Super wide bus memory 3D-SiP

Memory chip, Si-IP, logic chip and organic interposer are placed on the same data of [START].

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