Introduction to Co-Packaged Optics Design-Specific Features

① It supports mixed electrical and optical wiring designs and allows for connection recognition in complex 3D wiring structures with unlimited layer settings.

② It can be configured with electrical vias and optical vias, and is compatible with wiring networks.

③ Creating the shape of the optical transceiver: You can place, edit, and output the shape of the optical transceiver.

④ The need for global units: Millimeter-based patterns and micron-level patterns can be edited on the same data.

⑤ You can edit GEB, GDSⅡ, and DXF files together.

⑥ When optical wiring is configured using the optical wiring attribute, connection recognition is supported, and connection checks can be performed online.

*In addition, it implements dedicated functions essential for optoelectronic integrated design/editing/checking.

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